Equipment: WB Multi Bond Test System
Maker: CETEK
Model: HAWK1000
Equipment: Auto-Loader for Wire Bonder
Maker: ASM
Model: IBE139
Equipment: WIRE BONDER
Maker: K&S
Model: IConn
Equipment: WIRE BONDER
Maker: K&S
Model: Maxum Plus
Equipment: WIRE BONDER
Maker: K&S
Model: Maxum Ultra
Equipment: WIRE BONDER
Maker: Shinkawa
Model: UTC1000 Super
Equipment: WIRE BONDER
Maker: Shinkawa
Model: UTC2000 Super
Equipment: WIRE BONDER
Maker: Shinkawa
Model: UTC3000 Super
Equipment: WIRE BONDER
Maker: Shinkawa
Model: UTC3000WE
Equipment: Wire Bonder
Maker: Shinkawa
Model: ACB-3000
Equipment: WB Multi Bond Test System
Maker: CETEK
Model: HAWK1000
Equipment: Auto-Loader for Wire Bonder
Maker: ASM
Model: IBE139
Equipment: WIRE BONDER
Maker: K&S
Model: IConn
Equipment: WIRE BONDER
Maker: K&S
Model: Maxum Plus
Equipment: WIRE BONDER
Maker: K&S
Model: Maxum Ultra
Equipment: WIRE BONDER
Maker: Shinkawa
Model: UTC1000 Super
Equipment: WIRE BONDER
Maker: Shinkawa
Model: UTC2000 Super
Equipment: WIRE BONDER
Maker: Shinkawa
Model: UTC3000 Super
Equipment: WIRE BONDER
Maker: Shinkawa
Model: UTC3000WE
Equipment: Wire Bonder
Maker: Shinkawa
Model: ACB-3000
ASE Semiconductor
Address. Suite 410, Korea Business Center B/D 309,
Gangnam-daero, Seocho-gu, Seoul, South Korea
E-mail. info@asesemiconductor.com
Tel. +82-2-582-6900
Fax. +82-2-582-6903
