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FAB
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FAB
- PHOTO
- ETCH
- CVD
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- DIFFUSION
  - FURNACE
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ATE
- TESTER
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PKG
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Contact Us

SFB-200

ASE ID	2003201
Description	Flip Chip Bonder
Manufacturer	Shinkawa
Model	SFB-200
Vintage	May, 2003
Wafer size
Condition	Working Condition
Serial No	Please Contact Us (Click)
Configuration	Please Contact Us (Click)
Equipment Details	De-installed, Warehoused, Can be inspected

ASE Semiconductor

Address. Suite 410, Korea Business Center B/D 309,

Gangnam-daero, Seocho-gu, Seoul, South Korea

E-mail. info@asesemiconductor.com

Tel. +82-2-582-6900

Fax. +82-2-582-6903

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