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FAB
- PHOTO
- ETCH
- CVD
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- DIFFUSION
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  - WET
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- CMP
- ETC
ATE
- TESTER
- PROBER
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- ETC
PKG
- BACK GRINDER
- DICING SAW
- DIE BONDER
- WIRE BONDER
- SMT
- ETC
OTHERS
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- PUMP
- ETC

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FAB
- PHOTO
- ETCH
- CVD
- PVD
- DIFFUSION
  - FURNACE
  - WET
- METROLOGY
- CMP
- ETC
ATE
- TESTER
- PROBER
- HANDLER
- ETC
PKG
- BACK GRINDER
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- WIRE BONDER
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English
中文 (简体)

PRODUCT

FAB
- PHOTO
- ETCH
- CVD
- PVD
- DIFFUSION
  - FURNACE
  - WET
- METROLOGY
- CMP
- ETC
ATE
- TESTER
- PROBER
- HANDLER
- ETC
PKG
- BACK GRINDER
- DICING SAW
- DIE BONDER
- WIRE BONDER
- SMT
- ETC
OTHERS
- MICROSCOPE
- PUMP
- ETC

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      - A412
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Contact Us

FCB3

ASE ID	1305201
Description	Flip Chip Bonder
Manufacturer	Panasonic
Model	FCB3
Vintage	2007
Wafer size
Condition	As-Is, Where-Is
Serial No	Please Contact Us (Click)
Configuration	Please Contact Us (Click)
Equipment Details	De-installed, Warehoused, Can be inspected

ASE Semiconductor

Address. Suite 410, Korea Business Center B/D 309,

Gangnam-daero, Seocho-gu, Seoul, South Korea

E-mail. info@asesemiconductor.com

Tel. +82-2-582-6900

Fax. +82-2-582-6903

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