Equipment: Die Sorter
Maker: Laurier
Model: DS9000
Equipment: Flip Chip Bonder
Maker: Shinkawa
Model: SFB-200
Equipment: Flip Chip Bonder
Maker: Panasonic
Model: FCB3
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 2200 apm+
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 2200 EVO
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 8800 FC QUANTUM
Equipment: DIE BONDER
Maker: ESEC
Model: 2008xP
Equipment: DIE BONDER
Maker: ESEC
Model: 2008hS3 plus
Equipment: DIE BONDER
Maker: Shinkawa
Model: SPA300SUPER
Equipment: DIE BONDER
Maker: Renesas
Model: CM-700
Equipment: DIE BONDER
Maker: Renesas
Model: CM700H
Equipment: DIE BONDER
Maker: RENESAS
Model: DB700
Equipment: CHIP ON WAFER BONDER
Maker: TORAY
Model: FC-5000WL
Equipment: Die Sorter
Maker: Laurier
Model: DS9000
Equipment: Flip Chip Bonder
Maker: Shinkawa
Model: SFB-200
Equipment: Flip Chip Bonder
Maker: Panasonic
Model: FCB3
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 2200 apm+
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 2200 EVO
Equipment: Flip Chip Bonder
Maker: DATACON
Model: 8800 FC QUANTUM
Equipment: DIE BONDER
Maker: ESEC
Model: 2008xP
Equipment: DIE BONDER
Maker: ESEC
Model: 2008hS3 plus
Equipment: DIE BONDER
Maker: Shinkawa
Model: SPA300SUPER
Equipment: DIE BONDER
Maker: Renesas
Model: CM-700
Equipment: DIE BONDER
Maker: Renesas
Model: CM700H
Equipment: DIE BONDER
Maker: RENESAS
Model: DB700
Equipment: CHIP ON WAFER BONDER
Maker: TORAY
Model: FC-5000WL
ASE Semiconductor
Address. Suite 410, Korea Business Center B/D 309,
Gangnam-daero, Seocho-gu, Seoul, South Korea
E-mail. info@asesemiconductor.com
Tel. +82-2-582-6900
Fax. +82-2-582-6903
