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PKG > DIE BONDER > HITACHI SPA300SUPER DIE BONDER
ASE ID 2008206
Description DIE BONDER
Manufacturer HITACHI
Model SPA300SUPER
Vintage Nov 2005
Serial No C4-55198
Wafer size 300MM
Quantity 22
Condition Working Condition
Equipment Details - De-installed
- Warehoused
- Can be inspected by appointment
Attachments 13
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Contact

TEL +82-2-582-6900
FAX +82 2-582-6903
Info@asesemiconductor.com

Business Hours

Weekday: 09:00 - 18:00
Weekend: Closed

Directions

309, Gangnam-daero, Seocho-gu, Seoul, South Korea
Suite 410, Korean Business Center B/D