ASE ID | 2008206 |
Description | DIE BONDER |
Manufacturer | HITACHI |
Model | SPA300SUPER |
Vintage | Nov 2005 |
Serial No | C4-55198 |
Wafer size | 300MM |
Quantity | 22 |
Condition | Working Condition |
Equipment Details | - De-installed - Warehoused - Can be inspected by appointment |
Attachments | 13 |

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