| ASE ID | 2008206 |
| Description | DIE BONDER |
| Manufacturer | HITACHI |
| Model | SPA300SUPER |
| Vintage | Nov 2005 |
| Serial No | C4-55198 |
| Wafer size | 300MM |
| Quantity | 22 |
| Condition | Working Condition |
| Equipment Details | - De-installed - Warehoused - Can be inspected by appointment |
| Attachments | 13 |
Inquiry