| ASE ID | 200331201 |
| Description | Flip Chip Bonder |
| Manufacturer | Shinkawa |
| Model | SFB200 |
| Vintage | May, 2003 |
| Serial No | AO-49336 |
| Wafer size | |
| Quantity | 1 |
| Condition | As-is, Where-is |
| Equipment Details | - De-installed - Warehoused - Can be inspected by appointment |
| Attachments | 15 |
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